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The TTTech Aerospace team will join the Intel Federal Summit 2022 at Ronald Reagan Building and International Trade Center, in Washington, D.C., USA from June 21-22, 2022.

As a silver sponsor of the NDA-level Intel event, we will introduce our product portfolio for aerospace applications at booth #306. We will also give a presentation about our cooperation with Intel.

PRODUCT HIGHLIGHT
PRESENTATION
  • Date/time: June 22, 2022 - Session "Connectivity" (1:30 - 2:00 pm)
  • Title: The ultimate onboard level A certifiable networked computing platform HPC and HPDN solution
  • Presenters: Kurt Doppelbauer, VP Strategic Sales & Reinhard Maier, Director Product Management
EVENT WEBSITE
Event Type
Fair/Conference
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